Product Introduction
IPC class 2 and 3, JEDEC and MIL standards are available.
* PCB Designs for space, military, medical and commercial applications
* Extensive RF and analog design experience (printed antennas, guard rings , RF shields…)
* Signal integrity issues to meet your digital design needs (tuned traces, diff pairs…)
* PCB Layer management for signal integrity and impedance control
* PCB Designs for space, military, medical and commercial applications
* Extensive RF and analog design experience (printed antennas, guard rings , RF shields…)
* Signal integrity issues to meet your digital design needs (tuned traces, diff pairs…)
* PCB Layer management for signal integrity and impedance control
* Low level analog PCB designs .
* Ultra low EMI designs for MRI applications
* Complete assembly drawings
* In-Circuit Test data generation (ICT)
* Drill, panel and cutout drawings design
* Professional fabrication documents creation
* Autorouting for dense PCB designs
* DDR, DDR2, DDR3, DDR4, SAS and differential pair routing expertise
* High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…)
* Ultra low EMI designs for MRI applications
* Complete assembly drawings
* In-Circuit Test data generation (ICT)
* Drill, panel and cutout drawings design
* Professional fabrication documents creation
* Autorouting for dense PCB designs
* DDR, DDR2, DDR3, DDR4, SAS and differential pair routing expertise
* High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…)
* Single/double sided
* Multilayer; through via hole, blind/buried via and laser via technologies
* Flexible / flexi-rigid printed circuits
* HDI Designs with micro vias and advanced materials – Via-in-Pad, laser micro vias.
* High speed, multi layer digital PCB designs – Bus routing, differential pairs, matched lengths.
* Blind & Buried via ,Flex PCB designs, flexible rigid board of all types.
* Multilayer; through via hole, blind/buried via and laser via technologies
* Flexible / flexi-rigid printed circuits
* HDI Designs with micro vias and advanced materials – Via-in-Pad, laser micro vias.
* High speed, multi layer digital PCB designs – Bus routing, differential pairs, matched lengths.
* Blind & Buried via ,Flex PCB designs, flexible rigid board of all types.
