Essential details
Shipping:Express delivery
Product Introduction
Module Board
FR4, TG150, 8L, 1.2mm±10%
Copper Thickness: Inner/Outer 1OZ
Min. Hole Size: 0.25mm
Line Width/Spacing: 4/3mil
Surface Finish: Immersion Gold 2μ’’
Module Board
FR4, TG150, 8L, 1.2mm±10%
Copper Thickness: Inner/Outer 1OZ
Min. Hole Size: 0.25mm
Line Width/Spacing: 4/3mil
Surface Finish: Immersion Gold 2μ’’