Essential details
Shipping:Express delivery
Product Introduction
Module Board
FR4, TG170,
4L, 1.0mm±10%
Copper Thickness: Inner/Outer 1OZ
Min. Hole Size: 0.2mm
Line Width/Spacing: 4/4mil
Surface Finish:
Immersion Gold 3μ’’+ Gold Fingers 32μ’’
Module Board
FOB
Shipping:
Express delivery
Product details
FAQ
Leave your information and
we will contact you.
we will contact you.